Matrix design
Control sound in all dimensions
The HOLOPLOT Matrix Array enables a new level of sound control.
The matrix arrangement of loudspeaker drivers of different sizes – in a unique multi-layered configuration – enables control over sound propagation across a large frequency range, while providing the SPL and quality desired for high-performance sound reproduction.
The Modul 96 (MD96) is a two-way Audio Module integrating 96 drivers in a two-layered matrix design. The Modul 80-S (MD80-S) is a three-way Audio Module with 80 drivers in its first two matrix layers and a sensor-controlled subwoofer driver in its third layer.
Individual amplification channels for each driver are integrated into the X1 Audio Modules, eliminating the need to provide separate amplification racks.
Modul 96
Modul 80-S
Powerful processing
Create up to 12 beams per array
Each HOLOPLOT X1 Audio Module is equipped with a specialized processing module that integrates the strengths of two worlds.
First, a dual-core ARM® Cortex™-A9 runs HOLOPLOT OS, a Linux-based, distributed audio operating system. Second, a high-performance Field Programmable Gate Array (FPGA) computes the HOLOPLOT proprietary digital signal processing algorithms for 3D Audio-Beamforming and Wave Field Synthesis. This powerful DSP provides individual control to each of the 96 drivers of the X1 Audio Module and gives full sound field control for multiple beams in both horizontal and vertical directions.
Each Audio Module provides more than 200 input channels fed with either object-based or channel-based audio streams. A routing matrix running on the FPGA downmixes these 200 channels into 12 individually controlled beams. Each beam can be equalized and tailored to taste by 24 parametric EQ bands.
Cloud-connected system
Over-the-air updates & upgrades
Proactive support
Remote monitoring & system management
Smart problem identification & resolution
Synced with HOLOPLOT Cloud
Analysis of long-term system and usage data
Full introspection
Orientation sensors
Front-facing LEDs
Infrared transceivers
Color touch screen
Electric & acoustic self-tests
Integration of external sensor-data
Modular design
Scalable to endless applications
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Both left and right Matrix Arrays are optimized to cover the entire audience homogeneously, providing precise sound source localization across the stage for every audience member. Further, room excitation is reduced due to the precise coverage, delivering sound with unparalleled brilliance and clarity.
An additional continuous Matrix Array above the stage (“proscenium array”), combined with a surround layer of distributed Audio Modules, enables moving audio objects smoothly around the audience, with precise localization of sound sources across the entire room. This configuration delivers the ultimate immersive experience, making full use of HOLOPLOT’s creative potential.
X1 Rigging System
Simple, flexible deployment
The X1 rigging system is designed to locate and secure the HOLOPLOT X1 Audio Modules MD96 and MD80-S in permanent and temporary installations. The system consists of a number of structural components which have been designed for the flexible, easy, and safe deployment of a HOLOPLOT Matrix Array.
X1 Liftbars (left & right) connect the X1 Liftbar at the top of each column to the X1 Sideplates on the top Audio Module. There are no moving or loose parts on the X1 Liftbars. Mounting holes are available to influence the array tilt angle. Notches at the top of the bars index hole positions. Construction is welded steel fastened with screws.
The X1 Liftbar transfers the load of the entire X1 array to a rigging point. One X1 Liftbar is required at the top of each column. Two captive quick release pins (QRP) are available for attachment to the X1 Liftbars. There are 3 x 21 mm holes in the top of the X1 Liftbar locations to accommodate 3.75T shackles. Construction is welded steel.
X1 Sideplates (left & right) are affixed to the left and right MD96 or MD80-S Audio Modules. Assembled from steel sheets and screwed together around locking components. There are different X1 Sideplate parts for the left and right sides of the Audio Module. The MD96 and MD80-S both use the same X1 Sideplate assemblies. X1 Sideplates are hung from other X1 Sideplates, or X1 Liftbars using an internal locking bar that is opened and secured with front-accessible levers.
X1 Modul 96
Two-way Audio Module
Configuration: Two-layer Matrix Arrangement
LF layer
18x 5-inch cone driver in individual dual-ported chambers
HF layer
78x 1.3-inch soft dome tweeter with integrated waveguides
Maximum SPL (one unit, optimized parallel beam configuration*)
LF layer
LF layer
152 dB**
Frequency
Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis
Up to 12 beams in parallel per X1 Matrix Array:
a. 8 fully user-configurable parametric beams and virtual sources
b. 4 beams providing optimized coverage over a predefined audience area
Amplification
LF: 18x 500 Wpk
Connectors
AC Power OUT (208 – 240 V AC, 50 – 60 Hz)
Measurements
X1 Modul 80-S
Three-way Audio Module
Configuration: Three-layer Matrix Arrangement
Maximum SPL (one unit, optimized parallel beam configuration*)
LF layer
HF layer
152 dB**
Frequency
81
Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis
a. 8 fully user-configurable parametric beams and virtual sources
b. 4 beams providing optimized coverage over a predefined audience area
Amplification
1x single-channel digital subwoofer amplifier module with differential pressure sensor and zero-latency-DSP for adaptive closed-loop processing of the subwoofer driver signal
LF: 16x 500 Wpk
HF: 64x 240 Wpk
Connectors
AC Power OUT (208 – 240 V AC, 50 – 60 Hz)
Measurements
