Matrix design

Control sound in all dimensions

The HOLOPLOT Matrix Array enables a new level of sound control.

The matrix arrangement of loudspeaker drivers of different sizes – in a unique multi-layered configuration – enables control over sound propagation across a large frequency range, while providing the SPL and quality desired for high-performance sound reproduction.

The Modul 96 (MD96) is a two-way Audio Module integrating 96 drivers in a two-layered matrix design. The Modul 80-S (MD80-S) is a three-way Audio Module with 80 drivers in its first two matrix layers and a sensor-controlled subwoofer driver in its third layer.

Individual amplification channels for each driver are integrated into the X1 Audio Modules, eliminating the need to provide separate amplification racks.

Modul 96
Modul 80-S

X1 Rigging System

Simple, flexible deployment


The X1 rigging system is designed to locate and secure the HOLOPLOT X1 Audio Modules MD96 and MD80-S in permanent and temporary installations. The system consists of a number of structural components which have been designed for the flexible, easy, and safe deployment of a HOLOPLOT Matrix Array.

X1 Liftbars (left & right) connect the X1 Liftbar at the top of each column to the X1 Sideplates on the top Audio Module. There are no moving or loose parts on the X1 Liftbars. Mounting holes are available to influence the array tilt angle. Notches at the top of the bars index hole positions. Construction is welded steel fastened with screws.

The X1 Liftbar transfers the load of the entire X1 array to a rigging point. One X1 Liftbar is required at the top of each column. Two captive quick release pins (QRP) are available for attachment to the X1 Liftbars. There are 3 x 21 mm holes in the top of the X1 Liftbar locations to accommodate 3.75T shackles. Construction is welded steel.

X1 Sideplates (left & right) are affixed to the left and right MD96 or MD80-S Audio Modules. Assembled from steel sheets and screwed together around locking components. There are different X1 Sideplate parts for the left and right sides of the Audio Module. The MD96 and MD80-S both use the same X1 Sideplate assemblies. X1 Sideplates are hung from other X1 Sideplates, or X1 Liftbars using an internal locking bar that is opened and secured with front-accessible levers.

X1 Modul 96

Two-way Audio Module

Configuration: Two-layer Matrix Arrangement

LF layer

18x 5-inch cone driver in individual dual-ported chambers

HF layer

78x 1.3-inch soft dome tweeter with integrated waveguides

Maximum SPL (one unit, optimized parallel beam configuration*)

LF layer

142 dB**

LF layer

152 dB**

* Max. SPL capabilities are dependent on beam configuration and array size, and should be assessed using HOLOPLOT Software Tools ** Peak level referred back to 1 m under free field conditions using band-limited pink noise with crest factor 4

X1 Modul 80-S

Three-way Audio Module

Configuration: Three-layer Matrix Arrangement

Sub layer
1x 18-inch sensor-controlled subwoofer with two high energy, high density neodymium-iron-boron magnets in a bandpass enclosure with air-flow optimised ports
LF layer
16x 5-inch cone driver in individual dual-ported chambers
HF layer
64x 1.3-inch soft dome tweeter with integrated waveguides

Maximum SPL (one unit, optimized parallel beam configuration*)

Sub layer
131 dB (full space) / 137 dB (half space)**

LF layer

142 dB**

HF layer

152 dB**

* Max. SPL capabilities are dependent on beam configuration and array size, and should be assessed using HOLOPLOT Software Tools ** Peak level referred back to 1 m under free field conditions using band-limited pink noise with crest factor 4

HOLOPLOT X2 Matrix Array

It's all about control

Freedom has never sounded so controlled. Place sound precisely where you need it and precisely where you don’t. Create sound fields that optimally cover audience areas of any shape and size, with exceptionally authentic sound localization, lifelike distance, and directional perception of audio sources.

HOLOPLOT Matrix Arrays utilize a powerful combination of 3D Audio-Beamforming and Wave Field Synthesis, for the precise shaping and steering of beams in two dimensions – transforming the way we can use and experience sound. 

HOLOPLOT X2

X2 Modul 30

Technical Data

Configuration: Single-layer matrix arrangement

Full-range drivers
30 x 2.5″ cone driver

Maximum SPL (one unit, optimized parallel beam configuration*)

at 1 m
130 dB

Max. SPL capabilities are dependent on beam configuration (incl. the cut-off frequency) as well as array size, and should be assessed using HOLOPLOT Plan. Peak level referred back to 1 m under free field conditions using bandpass filtered pink noise signal with a 12 dB crest factor according to IEC 60268 and an optimized parallel beam configuration

 

Frequency Range

Standard
(max. SPL: 130 dB)

140 – 18,000 Hz (-3 dB)

110 – 20,000 Hz (-10 dB)

Low-frequency extension mode
(max. SPL: 125 dB)

100 – 18,000 Hz (-3 dB)

80 – 20,000 Hz (-10 dB)

Beamforming Capabilities: HOLOPLOT 3D Audio-Beamforming and Wave Field Synthesis

Number of beams

Up to 12 beams in parallel per X2 Matrix Array, each beam with its own audio input channel, equalization, level, shape, and position:

8 fully user-configurable parametric beams and virtual sources

4 beams providing optimized coverage over a predefined audience area

Vertical directivity

Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage

Horizontal directivity

Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage

Amplification

Type
Digital amplifier
Number of Channels
30 (one per loudspeaker driver)

Processing

Type
High-performance Field Programmable Gate Array (FPGA) computing the HOLOPLOT proprietary digital signal processing algorithms for 3D Audio-Beamforming and Wave Field Synthesis Dual-core ARM® Cortex™-A53 running HOLOPLOT OS
DSP Channels
30 (one per amplifier channel/loudspeaker driver)

Power Consumption

Standby
5W (Green Power Standby Mode)
Idle

18w

Max. Power
IEEE standard 802.3bt Type 4 1x PoE++: 90 W 2x PoE++: 180 W

Connectivity

Ethernet for Audio / Control / Power
2x Cat 6A (RJ45) – primary & secondary The use of the secondary port is optional, providing redundant communication and power, and also increasing the continuous power capacity Power: PoE++ (802.3bt Type 4) Audio-over-IP: AES67, RAVENNA (optional: Dante®) Control-over-IP: HOLOPLOT Control Network, OCA/AES70
Analog Audio
2x 3-pin Phoenix Connector – input & through primary 2x 3-pin Phoenix Connector – input & through secondary Input impedance: >20 kOhm balanced differential
Fault Relay
2x 3-pin Phoenix Connector – input & through – dry contact offering both open or short to indicate fault/lack of power

Physical Characteristics

Dimensions (w x h x d)
600 mm x 310 mm x 129 mm / 23.6″ x 12.2″ x 5.1″
Weight
16.5 kg / 36.4 lbs
Color

Standard: Black (RAL 9005) or White (RAL 9003)

Optional: Custom colors (RAL classics, NCS, and Pantone)